Materials for Electronic Packaging by Deborah D. L. Chung (Hardcover - Illustrated)
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Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat ...
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Pages: 368, Hardcover, Butterworth-Heinemann
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Pages: 368, Hardcover, Butterworth-Heinemann
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Hardcover Materials for Electronic Packaging examines the interconnections, encapsulations, ...
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