Materials for Electronic Packaging by Deborah D. L. Chung (Hardcover - Illustrated)

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Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat ... more at Buy.com
Pages: 368, Hardcover, Butterworth-Heinemann more at Amazon.com

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Pages: 368, Hardcover, Butterworth-Heinemann more at Amazon Marketplace

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Hardcover Materials for Electronic Packaging examines the interconnections, encapsulations, ... more at Borders.com

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